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Continuous reheating furnace for manufacturing direct copper bonding-substrate, has running rollers provided at high temperature region of muffle for transporting direct copper bonding-substrate, and bearing that bears running rollers
Continuous reheating furnace for manufacturing direct copper bonding-substrate, has running rollers provided at high temperature region of muffle for transporting direct copper bonding-substrate, and bearing that bears running rollers
The furnace (1) has a muffle for a direct copper bonding-substrate, and running rollers provided at a high temperature region (14) of the muffle for transporting the direct copper bonding-substrate. A bearing (22) bears the running rollers. The muffle comprises an inlet region (13), the high temperature region and an outlet region (15). Temperatures at the inlet and outlet regions are smaller than temperature of the high temperature region. The running rollers and/or the bearing are made of metal or ceramics. The running rollers comprise a contoured surface.
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