首页> 外国专利> Continuous reheating furnace for manufacturing direct copper bonding-substrate, has running rollers provided at high temperature region of muffle for transporting direct copper bonding-substrate, and bearing that bears running rollers

Continuous reheating furnace for manufacturing direct copper bonding-substrate, has running rollers provided at high temperature region of muffle for transporting direct copper bonding-substrate, and bearing that bears running rollers

机译:用于制造直接铜键合基板的连续加热炉,在马弗炉的高温区域设置有用于输送直接铜键合基板的运转辊,以及支承该运转辊的轴承

摘要

The furnace (1) has a muffle for a direct copper bonding-substrate, and running rollers provided at a high temperature region (14) of the muffle for transporting the direct copper bonding-substrate. A bearing (22) bears the running rollers. The muffle comprises an inlet region (13), the high temperature region and an outlet region (15). Temperatures at the inlet and outlet regions are smaller than temperature of the high temperature region. The running rollers and/or the bearing are made of metal or ceramics. The running rollers comprise a contoured surface.
机译:炉子(1)具有用于直接铜键合基板的马弗炉,以及设置在马弗炉的高温区域(14)中的用于输送直接铜键合基板的运转辊。轴承(22)支撑运行滚轮。马弗炉包括入口区域(13),高温区域和出口区域(15)。入口和出口区域的温度小于高温区域的温度。滚轮和/或轴承由金属或陶瓷制成。运转辊包括轮廓表面。

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