Applying a protective layer on a substrate, comprises introducing plate shaped substrates into a vacuum system, treating the substrate in the vacuum system, and applying a ribbon-shaped protective film on the substrate

摘要

The method comprises introducing plate shaped substrates (1) into a vacuum system, treating the substrate in the vacuum system, applying a ribbon-shaped protective film on the substrate, and discharging the treated substrate from the vacuum system. The method is carried out under the action of mechanical pressure and/or temperature. The protective film is treated in the vacuum system before or after its application on the substrate and supplied to the substrate from a band-shaped dispenser roll arranged in the vacuum system. The method comprises introducing plate shaped substrates (1) into a vacuum system, treating the substrate in the vacuum system, applying a ribbon-shaped protective film on the substrate, and discharging the treated substrate from the vacuum system. The method is carried out under the action of mechanical pressure and/or temperature. The protective film is treated in the vacuum system before or after its application on the substrate and supplied to the substrate from a band-shaped dispenser roll arranged in the vacuum system. The separation of the substrates takes place only when a further substrate is partially occupied in the vacuum system. The detachment of the protective film, directly before or during the manufacturing step, takes place after discharging the substrate. An independent claim is included for an apparatus for applying a protective layer on a substrate.