Cost a method for forming of highly dense passive capacitors for replacing discrete capacitors with the use of a least-cost modular 3d - wafer - wafer - integration scheme

摘要

Passive 3d - ic - capacitor stack of high density and a method for the integration of capacitors and integrated circuits in a wafer - wafer - bonding process, the integration of the capacitors, are formed on a wafer, alone or with active devices, with one or more integrated circuits on one or more additional wafers, the process can be stacked gemäßdem. The wafer - wafer - bonding takes place preferably by means of thermocompression, wherein grinding and chemically - mechanical polishing be used in order to simplify aspects of the manufacturing process. Various features and alternative embodiments.