It measures that a cost-effective and space-saving realization of a component, the at least a mems - component (1) and at least one further semiconductor component (2) in a common housing (10) with at least one access opening (13), wherein in the front side of the mems - component (1) at least one membrane structure (3) is formed, which a cavity (4) in the rear side of the mems - component (1), and wherein the housing (10) comprises a carrier (11), on which the mems - component (1) is mounted.According to the invention, the mems - component (1) with its front side on the carrier (11) mounted so that a distance between the membrane structure (3) and the support surface is. The at least one further semiconductor component (2) is connected to the rear side of the mems - component (1), so that the mems - component (1) and the semiconductor component (2) form a stack of chips.
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