Printing stencil for applying e.g. solder paste in printed circuit board assembly for fastening surface mounted device components on printed circuit board, has plastic interlayer arranged between metal top layer and metal lower layer

摘要

The stencil (1) has a triple-layer stencil part (2) clamped in a stencil frame (3), and a plastic interlayer arranged between a squeegee-sided metal top layer and a printing-sided metal lower layer. The metal top layer and the metal lower layer are made of stainless steel, and thickness of the plastic interlayer is greater than 70 percent of total thickness of the stencil part. The plastic interlayer is made of polyimide, and the thickness of the plastic interlayer is in the range of 50 and 150 micrometers.