Method for manufacturing printed circuit board, involves exposing protective layer to remove wiring areas, and providing photosensitive layer between tracks, where thickness of photosensitive layer is equal to thickness of tracks

摘要

The method involves providing an insulator (1) that is coated with copper (2), and providing tracks in an electrically conductive alloy (3). A selective etching is performed on each of outer surfaces, and a photosensitive dry film is laminated. The tracks are provided with wiring areas. The alloy is etched from the wiring areas. A protective layer is coated on the surfaces. The protective layer is exposed to remove wiring areas. A photosensitive layer (6) is provided between the tracks, where thickness of the photosensitive layer is equal to thickness of the tracks. The protection layer is a solder resist brazing layer.