首页> 外国专利> PRINTED CIRCUIT BOARD MANUFACTURING METHOD, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND ELECTRONIC COMPONENT MOUNTING METHOD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND ELECTRONIC COMPONENT MOUNTING METHOD

机译:印刷电路板制造方法,电子零件制造方法和电子零件安装方法

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method, an electronic component manufacturing method, and an electronic component mounting method, with which it is possible to provide a conductor in each open hole after a circuit component is mounted.;SOLUTION: A through hole 10 is obtained by: deforming and press-fitting a lower part 22 of a masking sheet 20 into each open hole 4 of a printed board 1 through lamination and pressurization of the masking sheet 20 on and against the printed board 1; hardening the masking sheet 20 through heating of the printed board 1 and the masking sheet 20; mounting a circuit component for a wiring pattern formed on an exposed surface of the printed board 1; applying a mold resin covering the circuit component to the exposed surface of the printed board 1; heat-hardening the mold resin; peeling the masking sheet 20 off the printed board 1 to obtain an intermediate product; and forming a conductor in each open hole 4 opened in the intermediate product to integrate the conductor with the wiring pattern. It is possible to obtain reliable continuity by appropriately forming the conductor, so it is possible to favorably connect a pair of wiring patterns.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种印刷电路板制造方法,一种电子零件制造方法以及一种电子零件安装方法,利用它们可以在安装电路零件之后在每个裸眼孔中提供导体。通过以下方式获得通孔10:通过将掩蔽片材20层压并加压在印刷板1上并抵靠在其上,将掩蔽片材20的下部22变形并压配合到印刷板1的每个开口孔4中;通过加热印刷电路板1和遮蔽片20使遮蔽片20硬化。在印刷基板1的露出面上安装用于配线图案的电路部件。将覆盖电路部件的模制树脂涂覆到印刷板1的暴露表面上;对模具树脂进行热硬化;将遮蔽片20从印刷电路板1上剥离以获得中间产品。在形成于中间产品上的每个开孔4中形成导体,以使导体与布线图案成为一体。通过适当地形成导体可以获得可靠的连续性,因此可以良好地连接一对布线图案。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013157486A

    专利类型

  • 公开/公告日2013-08-15

    原文格式PDF

  • 申请/专利权人 SHIN ETSU POLYMER CO LTD;

    申请/专利号JP20120017439

  • 发明设计人 HOSONO NORIYOSHI;

    申请日2012-01-31

  • 分类号H05K3/46;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 17:02:45

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号