Packed electronic component manufacturing method for mounting on printed circuit board, involves pre-centrally allowing electronic component with respect to centering tool that is premounted in printed circuit board using pre-centering unit

摘要

The method involves partially over-molding two units of an electronic component with plastic during packing of the electronic component. A pre-centering unit (42) is formed during over-molding the units of the electronic component. The pre-centering unit pre-centrally allows the electronic component with respect to a centering tool that is premounted in a printed circuit board. The pre-centering unit is formed around a part of pins (22), and comprises longitudinally extended plastic strip and centered notches (56). An independent claim is also included for an electronic component for mounting on a printed circuit board.