MASK FILM DEPOSITION APPARATUS AND MASK FILM DEPOSITION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mask film deposition apparatus which can avoid the collision of a substrate end with a mask at the time point where the substrate overlaps with the mask and allows a high-precision mask film deposition in the state where the space between the substrate and the mask is maintained at an appropriate value.;SOLUTION: A substrate S is moved towards a specific direction along the surface to be deposited. Until the tip of the substrate S in the direction of movement reaches above a mask M which is held by a mask holding part, the mask M is held at a waiting position away from the moving path of the substrate S, and a control part 24 controls the inclination of the mask M so that the inclination of the substrate S detected by a substrate inclination detection part 22 may be in agreement with the inclination of the mask M. After the tip of the substrate S in the direction of movement reaches above the mask M, a spacing detection part 23 detects the spacing between the substrate S and the mask M, and the control part 24 moves the mask M closer to the substrate S by a predetermined space.;COPYRIGHT: (C)2013,JPO&INPIT