RESIN COMPOSITION, RESIN COMPOSITION SHEET AND MANUFACTURING METHOD FOR RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL, B-STAGE SHEET, SEMI-HARDENED RESIN COMPOSITION SHEET WITH METAL FOIL, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD, LED LIGHT SOURCE MEMBER, AND POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in flexibility and flowability in a sheet-like state, and shows a high thermal conductivity and high insulation properties as a hardened material, and to provide a resin composition sheet using the resin composition and a manufacturing method for the resin composition sheet, a resin composition sheet with metal foil, a metal base wiring board material, a metal base wiring board, an LED light source member, and a power semiconductor device.;SOLUTION: A resin composition includes an epoxy resin (A) having a biphenyl skeleton, an epoxy resin (B) liquid at normal temperature, a phenol resin (C), and an inorganic filler (D). Alumina is included as the inorganic filler (D). The content of the inorganic filler (D) is ≥75 mass% to the total solid content, and the oil absorption of the whole inorganic filler (D) contained is ≤7.5 ml/100 g.;COPYRIGHT: (C)2013,JPO&INPIT