RESIN COMPOSITION, A RESIN COMPOSITION SHEET AND A MANUFACTURING METHOD THEREOF, A RESIN COMPOSITION SHEET WITH AN ATTACHED METAL FOIL, A B-STAGE SHEET, A RESIN COMPOSITION SHEET WITH AN ATTACHED SEMI-CURED METAL FOIL, A MATERIAL FOR A METAL BASE WIRING BOARD, THE METAL BASE WIRING BOARD, AN LED LIGHT SOURCE MATERIAL, AND A POWER SEMICONDUCTOR DEVICE

摘要

PURPOSE: A resin composition is provided to have excellent flexibility and ability to flow when molded to a sheet, and have excellent thermal conductivity and high insulating performance after the hardening of the resin composition.;CONSTITUTION: A resin composition contains an epoxy resin having a biphenyl structure; an epoxy resin which is in a liquid state at room temperature; a phenol resin; and an inorganic filler which is alumina. The content of the inorganic filler is 75 wt% or more. The oil absorption amount of the total inorganic filler is 7.5 ml/100g or less. A resin composition sheet with an attached metal foil comprises a metal foil and a resin composition layer which is formed on the metal foil and formed of the resin composition.;COPYRIGHT KIPO 2013