RESIN COMPOSITION RESIN COMPOSITION SHEET AND METHOD OF MANUFACTURING RESIN COMPOSITION SHEET RESIN COMPOSITION SHEET WITH METAL FOIL B STAGE SHEET RESIN COMPOSITION SHEET WITH SEMI-CURED METAL FOIL METAL BASE WIRING BOARD MATERIAL METAL BASE WIRING BOARD LED LIGHT SOURCE MEMBER AND POWER SEMICONDUCTOR DEVICE

摘要

(A) an epoxy resin having a biphenyl skeleton, (B) a liquid epoxy resin at room temperature, (C) a phenolic resin, and (D) an inorganic filler, wherein (D) , The content of the inorganic filler (D) is not less than 75% by mass of the total solids, and the total amount of the inorganic filler (D) is not more than 7.5 ml / 100 g.;