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Method and system for combinatorial changes in the process sequence material, and unit process

机译:工序顺序物料和单元工序的组合变更的方法和系统

摘要

A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.
机译:提供了一种使用材料,单元工艺和工艺顺序的变化来分析和优化制造技术的方法。在该方法中,分析半导体制造工艺顺序和构建的子集以进行优化。在执行制造过程序列的子集期间,用于创建特定结构的材料,单元过程和过程序列会发生变化。在组合处理期间,在半导体衬底的离散区域之间改变材料,单元处理或处理顺序,其中,在每个区域内,该处理产生基本上均匀或一致的结果,该结果代表商业制造的结果。操作。还提供了用于优化过程顺序的工具。

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