首页>
外国专利>
Bridged interconnection of through-silicon vias
Bridged interconnection of through-silicon vias
展开▼
机译:硅通孔的桥接互连
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated circuit bridge interconnect system includes a first die and a second die provided in a side-by-side configuration and electrically interconnected to each other by a bridge die. The bridge die includes through silicon vias (TSVs) to connect conductive interconnect lines on the bridge die to the first die and the second die. Active circuitry, other than interconnect lines, may be provided on the bridge die. At least one or more additional die may be stacked on the bridge die and interconnected to the bridge die.
展开▼