首页> 外国专利> EDGE TERMINATION STRUCTURE FOR SILICON CARBIDE DEVICE AND MANUFACTURING METHOD OF SILICON CARBIDE DEVICE INCLUDING EDGE TERMINATION STRUCTURE

EDGE TERMINATION STRUCTURE FOR SILICON CARBIDE DEVICE AND MANUFACTURING METHOD OF SILICON CARBIDE DEVICE INCLUDING EDGE TERMINATION STRUCTURE

机译:碳化硅器件的边缘终止结构及包括边缘终止结构的碳化硅器件的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an improved edge termination structure of a silicon carbide device.;SOLUTION: The edge termination structure of a silicon carbide device has a plurality of floating guard rings 34 of concentric circle arranged at predetermined intervals, in a silicon carbide layer, so as to surround at least the silicon carbide base junction, an insulation layer provided on the floating guard rings, and a silicon carbide surface charge compensation region 38 provided between the floating guard rings closely to the surface of the silicon carbide layer. A silicon nitride layer 56 is provided on the silicon carbide layer, and an organic protective layer 66 is provided on the silicon nitride layer. An oxide film layer may exist between the silicon nitride layer and the surface of the silicon carbide layer. Formation of the edge termination structure and a manufacturing method are also disclosed.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种改进的碳化硅器件的边缘终止结构。解决方案:碳化硅器件的边缘终止结构具有多个以预定间隔布置在碳化硅中的同心圆浮动保护环34。层,以至少包围碳化硅基结,设置在浮动保护环上的绝缘层,以及设置在浮动保护环之间并紧靠碳化硅层表面的碳化硅表面电荷补偿区域38。在碳化硅层上提供氮化硅层56,并且在氮化硅层上提供有机保护层66。氧化膜层可以存在于氮化硅层与碳化硅层的表面之间。还公开了边缘终止结构的形成和制造方法。版权所有:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP2013062518A

    专利类型

  • 公开/公告日2013-04-04

    原文格式PDF

  • 申请/专利权人 CREE INC;

    申请/专利号JP20120232939

  • 发明设计人 ANANT K AGARWAL;WARD ALAN;RYU SEI-HYUNG;

    申请日2012-10-22

  • 分类号H01L29/06;H01L29/47;H01L29/872;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:27

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