Base substance film, back grinding film, and its production manner for multilayer back grinding

摘要

P To provide a substrate film for monolayer or multilayer back grinding that prevents a semiconductor wafer from being warped easily even if the substrate film is stuck to the semiconductor wafer in the back grinding process of the thin-type semiconductor wafer and has excellent dimensional stability and to provide a back grinding film. PSOLUTION: In the substrate film for multilayer back grinding, layers A, B and C are laminated in this order. The layer A contains a resin composition made of 0-70 wt.% of amorphous olefin and 30-100 wt.% of polypropylene-based resin. The layer B contains a resin composition made of 15-100 wt.% of amorphous olefin and 0-85 wt.% of polypropylene-based resin. The layer C contains a thermoplastic resin having rubber elasticity. The present invention relates to the substrate film for multilayer back grinding and the method of manufacturing the substrate film. PCOPYRIGHT: (C)2010 and JPO& INPIT