Touching to the principal plane of the adhesion film for circuit joint, and the base material and the said base material of the mannered null

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection which enables a mark for position identification of a circuit member to be sufficiently recognized by an electromagnetic wave transmitted through an adhesive layer stuck to the circuit member.;SOLUTION: An adhesive film 1 for circuit connection includes a film-like support body 2 and an insulating adhesive layer 3, provided in contact with the principal surface 2a of the support body 2, and the principal surface 2a on the side of the adhesive layer 3 of the support body 2 has a center line average roughness Ra of 0.3 μm or smaller.;COPYRIGHT: (C)2009,JPO&INPIT