Plating current density distribution measuring apparatus and plating current density distribution measurement method

摘要

To provide a means to achieve a precise measurement of the in-plane distribution of the plating current density at the cathode plate. At least partially disposed below the liquid surface of the plating solution contained in a plating tank, an anode and plated members; A plating bath is formed in the first insulator and the one on the surface with a first measuring electrode which is a first current measuring body the first insulator is disposed to face the part of the surface of the plating of the plated member is subjected; plating power source; Plating The first wire connects the anode terminal and the anode of the power source electrically; second wiring electrically connecting the cathode terminal and the plated member plating power source; plating power source cathode terminal, a first first current disposed and the third wiring; of the measuring electrode, and the first measuring electrode and the plated member has a third wire for electrically connecting to form a parallel relationship plating current density distribution measuring apparatus comprising a measuring means. [Selection Figure] Figure 1