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Thermosetting light-reflecting resin composition, optical semiconductor device mounting board and its manufacturing method and an optical semiconductor device

机译:热固性反光树脂组合物,光半导体装置安装基板及其制造方法和光半导体装置

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of obtaining a formed tablet having excellent mechanical strength without sticking on the surface of a pestle and a mortar of a forming die when forming the tablet, a substrate for mounting an optical semiconductor using the resin composition, a method of manufacturing the same, and an optical semiconductor device.;SOLUTION: The thermosetting resin composition for light reflection comprises an epoxy resin (A), a hardener (B), a hardening catalyst (C), an inorganic filler (D), a white pigment (E), and a coupling agent (F) wherein at least one of the inorganic filler (D) and the white filler (E) contains a porous filler or a compound having oil absorbency as a constituent. Also provided are the substrate for mounting an optical semiconductor using the resin composition, the method of manufacturing the same, and the optical semiconductor device.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:为了提供一种热固性树脂组合物,提供一种能够获得具有优异的机械强度而不会在成型片剂时粘附在成型模具的研杵和研钵的表面上的成型片剂,以及使用该方法固定光学半导体的基板。树脂组合物,其制造方法以及光学半导体装置。解决方案:用于光反射的热固性树脂组合物包含环氧树脂(A),硬化剂(B),硬化催化剂(C),无机填料(D),白色颜料(E)和偶联剂(F),其中无机填料(D)和白色填料(E)中的至少一种包含多孔填料或具有吸油性的化合物作为成分。还提供了使用该树脂组合物安装光半导体的基板,其制造方法以及光半导体装置。版权所有:(C)2009,日本特许厅&INPIT

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