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Electronic component package for housing, a plurality up electronic component housing package and electronic equipment, as well as their discrimination method
Electronic component package for housing, a plurality up electronic component housing package and electronic equipment, as well as their discrimination method
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机译:用于壳体的电子元件封装,多个电子元件壳体封装和电子设备及其辨别方法
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摘要
PROBLEM TO BE SOLVED: To provide a package for multiple housing of electronic components which allows efficiently and properly confirming an air-tightness of recesses for package regions for housing electronic components; a method of measuring a package for multiple housing of electronic components; a package for housing electronic components and a method of measuring a package for housing electronic components which allow properly confirming an air-tightness of recesses; and a highly reliable electronic device.;SOLUTION: The package for multiple housing of electronic components has: a mother board 1; a plurality of recesses 5 and a plurality of package regions for housing electronic components 6 corresponding to the plurality of recess 5 defined by a latticework structure 2 arranged on one of major surfaces of the mother board 1; and furthermore, a pair of electrodes for measurement 3 which is embedded between the mother board 1 and the latticework structure 2 of the package regions for housing electronic components 6 and is arranged spaced apart from each other.;COPYRIGHT: (C)2008,JPO&INPIT
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