Being production manner of the multilayer interconnection substrate where the component on-board field in order it does not possess

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board that lowers manufacturing cost.;SOLUTION: A coreless wiring board as the multilayer wiring board does not have a core substrate, and has a build-up layer 20 which is multilayered by stacking conductor layers 26 and resin insulating layers 21 to 24 alternately. An intermediate product 100 of the coreless wiring board has a stack metal sheet body 42 formed by stacking two pieces of copper foil 42a and 42b formed of a conductive metal material and bringing them into contact with each other in a peelable state. The conductor layers 26 and the resin insulating layers 21 to 24 are stacked alternately on both surfaces of the stack metal sheet body 42 to form the build-up layer 20.;COPYRIGHT: (C)2010,JPO&INPIT