Production manner, and vuiahuiru manner of multilayer interconnection substrate and multilayer interconnection substrate

摘要

The multilayer wiring substrate includes: a first insulating layer comprising a first surface and a second surface opposite to the first surface; a second insulating layer ON the first surface of the first insulating layer; a first wiring pattern ON the second surface of the first insulating layer; a second wiring pattern ON a surface of the second insulating layer; a first via formed through the first insulating layer; a second via formed through the second insulating layer; and a third wiring pattern formed ON the first surface of the first insulating layer and embedded in the second insulating layer and the third wiring pattern having a hole therethrough. A diameter of the hole is smaller than each diameter of the first and second vias. The first via and the second via are connected to each other through a metal filled in the hole of the third wiring pattern.