Production manner null of organicity resin multilayer interconnection substrate and organicity resin multilayer interconnection

摘要

PURPOSE:To protect polyimide resin against deterioration and to enable a multilayer wiring board to be shortened in time required for a laminating process by a method wherein conductor wiring layers and organic resin insulating layers are alternately laminated to form laminated blocks, the laminated blocks are bonded together, and through-viaholes are provided thereto. CONSTITUTION:Wiring layers such as a ground and connection wiring layer 11, signal wiring layers 13a and 13b, and the like and polyimide insulating layers 15 are alternately laminated on an aluminum plate 10 to form a laminated block 1, wiring layers such as ground and connection wiring layers 21 and 24, signal wiring layers 23a and 23b, and the like and polyimide insulating layers 26 are alternately laminated on a ceramic board 20 to form a laminated block 2, the laminated blocks 1 and 2 are bonded together, the aluminum plate 10 is separated off from the laminated block 1, and then through-viaholes 3 used for electrically connecting the laminated blocks 1 and 2 together are provided. By this constitution, polyimide resin can be protected against deterioration, and a multilayer wiring board can be lessened in time required for a laminating process.