The electrode board configuration body for the plasma central processing unit and the electrode board configuration

摘要

PROBLEM TO BE SOLVED: To improve in-plane uniformity of an etching depth by reducing a temperature difference occurring between the central part and the outer peripheral part of an electrode plate.;SOLUTION: An electrode-plate structure 20 is used in a plasma treatment device. The electrode-plate structure comprises: an electrode plate 3 to which a high-frequency voltage is applied; and a cooling plate 14 fixed on the rear face of the electrode plate 3 into a close contact state. The electrode plate 3 is configured such that the thickness t1 of the central part is formed smaller than the thickness t2 of the outer peripheral part. The cooling plate 14 is configured corresponding to the electrode plate 3 such that the thickness of the central part is formed larger than the thickness of the outer peripheral part.;COPYRIGHT: (C)2010,JPO&INPIT