Production method plated resin molded article, the plating resin molding, and molded circuit board plating and resin molded article

摘要

It is a technique plating for molded article obtained by molding the liquid-crystalline resin composition, without etching, is to provide a technique of liquid-crystalline resin composition of interest is not limited to a specific. A plated resin molded article having a plating film on the surface of a molded article obtained by molding the liquid-crystalline resin composition, by using a molded body is not formed a surface layer on the skin layer of the shaped body, the plating film material and the plating film it is formed by depositing the particles collide with the surface of the shaped body. As a method of forming a plating film to collide with the surface of the molded body plating film material particles, for example, ion plating, sputtering and the like.