首页> 外国专利> METHOD FOR PLATING ARTICLE MOLDED OF CRYSTALLINE POLYESTER RESIN, AND PLATED ARTICLE MOLDED OF CRYSTALLINE POLYESTER RESIN

METHOD FOR PLATING ARTICLE MOLDED OF CRYSTALLINE POLYESTER RESIN, AND PLATED ARTICLE MOLDED OF CRYSTALLINE POLYESTER RESIN

机译:结晶聚酯树脂的模铸件的涂覆方法以及结晶聚酯树脂的模铸件的涂覆方法

摘要

PROBLEM TO BE SOLVED: To provide a method for plating an article molded of a crystalline polyester resin so as to give superior adhesiveness to the plated film, and to provide a plated article with the method.;SOLUTION: The method for plating the article formed of the crystalline polyester resin comprises a step of roughening the article formed of the crystalline polyester resin into a surface roughness (Ra) of 0.5 μm or more by blast treatment, a step of shining an ultraviolet light having a wavelength of 300 nm or shorter onto the roughened surface of the formed article, and a step of plating the formed article treated in the above steps.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种镀覆由结晶聚酯树脂模制的制品的方法,以赋予镀膜以优异的粘附性,并提供一种利用该方法镀覆的制品。所述结晶聚酯树脂的步骤包括通过喷砂处理将由所述结晶聚酯树脂形成的制品粗糙化为0.5μm或更大的表面粗糙度(Ra)的步骤,发出波长为300nm的紫外光或缩短到成形品的粗糙表面上,然后进行在上述步骤中处理过的成形品的电镀步骤。;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004099918A

    专利类型

  • 公开/公告日2004-04-02

    原文格式PDF

  • 申请/专利权人 POLYPLASTICS CO;

    申请/专利号JP20020259462

  • 发明设计人 TAKAGI TATSUAKI;

    申请日2002-09-04

  • 分类号C23C18/20;C08J7/00;C23C18/28;C23C18/31;C23C18/38;C25D5/56;H05K9/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:30:32

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