CHIP-TO-WAFER BONDING METHOD AND THREE-DIMENSIONAL INTEGRATED SEMICONDUCTOR DEVICE

摘要

A chip-to-wafer bonding method and a three-dimensional integrated semiconductor device are provided. The method comprises providing a chip and a wafer having a bonding region of the same size and shape as the chip; preparing hydrophilic areas and hydrophobic areas on the chip; preparing in the bonding region hydrophilic areas and hydrophobic areas respectively corresponding to the hydrophilic and hydrophobic areas on the chip; adding a liquid drop onto the hydrophilic areas in the bonding region; and pre-aligning and placing the chip on the bonding region of the wafer, such that the hydrophilic areas on the chip each contacts the corresponding hydrophilic area in the bonding region via the liquid. The sum of perimeters of the hydrophilic areas on the chip is larger than a perimeter of the chip. The sum of perimeters of the hydrophilic areas in the bonding region is larger than a perimeter of the bonding region.