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STRUCTURE FOR STACKING PRINTED BOARD ASSEMBLIES IN ELECTRONIC DEVICE
STRUCTURE FOR STACKING PRINTED BOARD ASSEMBLIES IN ELECTRONIC DEVICE
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机译:用于堆叠电子设备中的印刷板组件的结构
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摘要
A structure for stacking Printed Board Assemblies (PBAs) in an electronic device is provided. The structure for stacking PBAs in an electronic device includes a clip mounted on a main Printed Circuit Board (PCB), a sub-PCB including a ground portion, a sub-PBA including the sub-PCB, and a clip header mounted on a lower part of the sub-PBA, wherein the clip header is inserted into the clip. Therefore, electronic components mounted on a main PCB can be shielded from outer electromagnetic waves while reducing material costs without using a shield can, and a sub-PBA can be stacked on the main PBA.
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