首页>
外国专利>
Method of Processing Wafers for Saving Material and Protecting Environment
Method of Processing Wafers for Saving Material and Protecting Environment
展开▼
机译:晶片加工的方法,以节省材料和保护环境
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of processing wafers for saving material and protecting environment is implemented to collect defective or incomplete wafers and perform cutting operation to create a plurality of separate dies. According to the requirement of a specification, the backs of the dies are grinded to allow each die to have a predetermined thickness. Thereafter, the grinded dies with completeness are sequentially placed onto a carrying means. With the method, the defective or incomplete wafers, which would be discarded in general wafer manufacturing, may be reclaimed to go through cutting, grinding, and selecting operations, so that the dies with completeness on the defective wafers can be picked out and processed again, so as to increase the yield, lower the manufacturing cost, reduce the amount of the wafer waste, increase the wafer utilization, and meet the demands of energy saving, carbon reduction, and environmental protection.
展开▼