METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE

摘要

A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.