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A MEMORY SYSTEM THAT UTILIZES A WIDE INPUT/OUTPUT (I/O) INTERFACE TO INTERFACE MEMORY STORAGE WITH AN INTERPOSER AND THAT UTILIZES A SERDES INTERFACE TO INTERFACE A MEMORY CONTROLLER WITH AN INTEGRATED CIRCUIT, AND A METHOD
A MEMORY SYSTEM THAT UTILIZES A WIDE INPUT/OUTPUT (I/O) INTERFACE TO INTERFACE MEMORY STORAGE WITH AN INTERPOSER AND THAT UTILIZES A SERDES INTERFACE TO INTERFACE A MEMORY CONTROLLER WITH AN INTEGRATED CIRCUIT, AND A METHOD
A memory system is provided in which at least one DRAM chip and a memory controller chip are mounted in a side-by-side relationship on an interposer. The DRAM chip is connected to the interposer via a Wide I/O interface to enable the DRAM chip and the memory controller chip to communicate with each other via the Wide I/O interface. The memory controller chip has a SerDes interface for communicating with a SerDes interface of an integrated circuit (IC) chip of the memory system.
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机译:提供一种存储系统,其中至少一个DRAM芯片和存储控制器芯片以并排关系安装在中介层上。 DRAM芯片通过Wide I / O接口连接到插入器,以使DRAM芯片和存储控制器芯片能够通过Wide I / O接口相互通信。存储器控制器芯片具有用于与存储器系统的集成电路(IC)芯片的SerDes接口通信的SerDes接口。
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