Implementing vertical die stacking to distribute logical function over multiple dies in through-silicon-via stacked semiconductor device

摘要

A method and circuit for implementing die stacking to distribute a logical function over multiple dies, die identification and sparing in through-silicon-via stacked semiconductor devices, and a design structure on which the subject circuit resides are provided. Each die in the die stack includes predefined functional logic for implementing a respective predefined function. The respective predefined function is executed in each respective die and a respective functional result is provided to an adjacent die in the die stack. Each die in the die stack includes logic for providing die identification. An operational die signature is formed by combining a plurality of selected signals on each die. A die signature is coupled to a next level adjacent die using TSV interconnections where it is combined with that die signature.