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Mesoscale and microscale device fabrication methods using split structures and alignment elements

机译:使用分裂结构和对准元件的中尺度和微尺度器件制造方法

摘要

Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
机译:本发明的各种实施例涉及使用电化学制造技术的中尺度或微尺度器件的形成,其中结构由作为开放结构的多层形成,该结构可以折叠或以其他方式组合以形成期望构造的结构。每一层由至少一种结构材料和至少一种牺牲材料形成。开放结构的初始形成可以促进牺牲材料的释放,形成较少层以完成结构的能力,将附加材料定位到结构中的能力,在结构开放时对暴露的区域执行附加处理操作的能力,和/或形成完全封装且可能为空心结构的能力。

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