首页>
外国专利>
Integrated circuit package system with bumped lead and nonbumped lead
Integrated circuit package system with bumped lead and nonbumped lead
展开▼
机译:具有凸块引线和非凸块引线的集成电路封装系统
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated circuit package system includes: forming an external interconnect; forming a terminal having a cavity adjacent to and downset from a portion the external interconnect; connecting a first integrated circuit with the external interconnect; and forming an encapsulation over the first integrated circuit with cavity filled with the encapsulation, the terminal extending from the encapsulation, and the external interconnect partially exposed from the encapsulation.
展开▼