首页> 外国专利> Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

机译:具有ic标签的片材的制造方法,具有ic标签的片材的制造装置,具有ic标签的片材,ic芯片的固定方法,ic芯片的固定装置及ic标签

摘要

A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.
机译:一种具有IC标签的薄片 1 的制造方法,其包括以下步骤:制备并馈送其上形成有电导体的薄片 21 a 。在具有导电体的板 21 a 上提供粘合剂 18 。准备多个IC芯片 20 ,并依次送入IC芯片 20 ;在片材 21 a 的电导体 22 上依次排列每个IC芯片 20 。通过粘合剂 18 将每个IC芯片 20 固定到导电体 22 上。在其上形成有电导体的片 21 a 包括不导电的片 21 和一对电导体 22 。具有导电体的片 21 a 中的一对导电体 22 设置在非导电性片 21 上B>,沿进给方向延伸,并且彼此隔开。

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