首页>
外国专利>
Method of forming a bump-on-lead flip chip interconnection having higher escape routing density
Method of forming a bump-on-lead flip chip interconnection having higher escape routing density
展开▼
机译:形成具有更高逸出布线密度的引线上凸块倒装芯片互连的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A flip chip interconnect is made by mating the interconnect bump directly onto a lead, rather than onto a capture pad. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having electrically conductive traces in a die attach surface, in which the bumps are mated directly onto the traces. In some embodiments the interconnection is formed without employing a solder mask. In some methods a curable adhesive is dispensed either onto the bumps on the die or onto the traces on the substrate; the adhesive is partly cured during the mating process, and the partly cured adhesive serves to confine the molten solder during a reflow process.
展开▼