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Efficient carrier injection in a semiconductor device

机译:半导体器件中的有效载流子注入

摘要

Semiconductor devices such as VCSELs, SELs, LEDs, and HBTs are manufactured to have a wide bandgap material near a narrow bandgap material. Electron injection is improved by an intermediate structure positioned between the wide bandgap material and the narrow bandgap material. The intermediate structure is an inflection, such as a plateau, in the ramping of the composition between the wide bandgap material and the narrow bandgap material. The intermediate structure is highly doped and has a composition with a desired low electron affinity. The injection structure can be used on the p-side of a device with a p-doped intermediate structure at high hole affinity.
机译:诸如VCSEL,SEL,LED和HBT之类的半导体器件被制造为在窄带隙材料附近具有宽带隙材料。通过位于宽带隙材料和窄带隙材料之间的中间结构来改善电子注入。中间结构是宽带隙材料和窄带隙材料之间的成分倾斜的拐点,例如平稳。中间结构是高度掺杂的,并具有所需的低电子亲和力的组成。注入结构可以以高空穴亲和力用于具有p掺杂中间结构的器件的p侧。

著录项

  • 公开/公告号US8325775B2

    专利类型

  • 公开/公告日2012-12-04

    原文格式PDF

  • 申请/专利权人 RALPH H. JOHNSON;

    申请/专利号US20100941940

  • 发明设计人 RALPH H. JOHNSON;

    申请日2010-11-08

  • 分类号H01S5/00;

  • 国家 US

  • 入库时间 2022-08-21 16:42:37

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