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heat curing epoxy resin composition, reinforcing element, process for bonding heat stable substrates, use of said composition and structural foam

机译:热固化环氧树脂组合物,增强元件,粘合热稳定基材的方法,所述组合物的用途和结构泡沫

摘要

Heat curing epoxy resin composition, reinforcement element, process for bonding heat stable substrates, use of said composition and structural foam. The present invention relates to the field of heat curing epoxy resin compositions and their use, more particularly in motor vehicle construction and sandwich panel construction. The heat curing epoxy resin compositions of the invention comprise, in addition to the epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activating component conversion A1, A2 and B. The compositions and structural foams produced therefrom are notable for their high mechanical strength, high glass resistance and good adhesion ability on metallic and non-metallic substrates, and it is possible at the same time to dispense with the use of toxic or flammable breath.
机译:热固化环氧树脂组合物,增强元件,粘合热稳定基材的方法,所述组合物的用途和结构泡沫。本发明涉及热固化环氧树脂组合物及其用途的领域,更具体地涉及在机动车辆构造和夹心板构造中。本发明的热固化环氧树脂组合物除了环氧树脂组分A1,任选地A2外还包含硬化剂组分B,羧酸C和羟烷基酰胺或羟烷基脲H,用于活化组分转化A1,A2和A的促进剂E。 B.由此产生的组合物和结构泡沫以其高机械强度,高玻璃抗性以及在金属和非金属基材上的良好粘附能力而著称,并且可以同时免除使用有毒或易燃的呼吸。

著录项

  • 公开/公告号BRPI1104634A2

    专利类型

  • 公开/公告日2013-01-15

    原文格式PDF

  • 申请/专利权人 SIKA TECHNOLOGY AG;

    申请/专利号BR2011PI04634

  • 发明设计人 JUERGEN FINTER;ELYES JENDOUBI;

    申请日2011-09-05

  • 分类号C08G59/40;C08G59/44;C08L63;C09J163;

  • 国家 BR

  • 入库时间 2022-08-21 16:42:11

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