Method for achieving improved epitaxy quality (surface texture and defect densitity) on free-standing (aluminum, indium, gallium) nitride ((Al, In, Ga)N) substrates for opto-electronic and electronic devices

摘要

A method of forming a III-V nitride homoepitaxial layer on a corresponding III-V nitride material substrate, comprising depositing the III-V nitride homoepitaxial layer by a VPE process using Group III source material and nitrogen source material under deposition conditions including V/III ratio in a range of from about 1 to about 10⁵, nitrogen source material partial pressure in a range of from about 1 to about 10³ torr, growth temperature in a range of from about 500 to about 1250 degrees Celsius, and growth rate in a range of from about 0.1 micron per hour to about 500 microns per hour.