An optical semiconductor package is provided with an optical semiconductor element, a temperature detection unit, and a temperature control unit (46) comprising a support member (46S). The optical semiconductor element and the temperature detection unit are disposed such that the temperature of a portion (P44) of the surface of the support member (46S) where the optical semiconductor element is disposed, and the temperature of a portion (P45) of the surface of the support member (46S) where the temperature detection unit is disposed are in a relationship wherein both the temperatures are approximately thermally balanced with each other.
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