A method of cutting light emitting element packages includes preparing a ceramic substrate (10) having a surface (12) on which a plurality of light emitting element chips (20) are mounted and a light-transmitting material layer (30) is formed to cover the plurality of light emitting element chips (20); partially removing the light-transmitting material layer (30) between the plurality of light emitting element chips (20) along a cutting line (C) by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate (10) along the cutting line (C) by using a laser cutting method.
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