首页> 外国专利> PROCESS FOR GROWING SILICON CARBIDE SINGLE CRYSTAL BY PHYSICAL VAPOR TRANSPORT METHOD AND ANNEALING SILICON CARBIDE SINGLE CRYSTAL IN SITU

PROCESS FOR GROWING SILICON CARBIDE SINGLE CRYSTAL BY PHYSICAL VAPOR TRANSPORT METHOD AND ANNEALING SILICON CARBIDE SINGLE CRYSTAL IN SITU

机译:物理气相传输法生长碳化硅单晶并在原位退火碳化硅单晶的过程

摘要

The invention provides a technology for growing silicon carbide single crystals by PVT (Physical Vapor Transport) and a technology for in-situ annealing the crystals after growth is finished. Specifically, the technology can achieve real-time dynamic control of the temperature distribution of growth chamber by regulating the position of the insulation layer on the upper part of the graphite crucible, thus controlling the temperature distribution of growth chamber in real-time during the growth process according to the needs of the technology, which helps to significantly improve the crystal quality and production yield. After growth is finished, the inert gas pressure in growth chamber is raised and meanwhile the temperature gradient of the growth chamber is reduced so that in-situ annealing the silicon carbide crystals can be carried out under a small one, which helps to reduce the stress between the crystal and the crucible lid as well as that in sublimation grown crystals, thereby reducing the breakage ratio and improving the yield ratio during the subsequent fabrication process.
机译:本发明提供了一种通过PVT(物理气相传输)生长碳化硅单晶的技术,以及一种在生长完成后对晶体进行原位退火的技术。具体而言,该技术可以通过调节石墨坩埚上部绝缘层的位置,实现对生长室温度分布的实时动态控制,从而在生长过程中实时控制生长室的温度分布。根据技术需要进行处理,这有助于显着提高晶体质量和产量。生长完成后,升高生长室中的惰性气体压力,同时降低生长室的温度梯度,以便可以在较小的温度下对碳化硅晶体进行原位退火,从而有助于降低应力在晶体和坩埚盖之间以及在升华生长的晶体中的晶体之间的夹角,从而降低了破损率并在随后的制造过程中提高了产率。

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