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Fabrication method of CuO thin film and TFT and it manufacturing the same method, CuO thin film transistor

机译:CuO薄膜和TFT的制造方法及其制造方法,CuO薄膜晶体管

摘要

PURPOSE: A method for forming a CuO thin film, a method for manufacturing an oxide thin film transistor, the oxide thin film transistor manufactured by the same, and the oxide thin film transistor with a CuO thin film are provided to improve electric field effect mobility and an on-off ratio by forming a CuO thin film at a low temperature. CONSTITUTION: A Cu2O thin film is formed by sputtering under Ar gas and O2 gas atmospheres(S1000). A Cu2O thin film is changed into a CuO thin film by a thermal process(S2000). A ratio of Ar gas to O2 gas is 4 : 1. A heating temperature of a thermal process is 100 to 500 degrees centigrade. The thermal process is performed under an air atmosphere. [Reference numerals] (AA) Start; (BB) End; (S1000) Forming a Cu2O thin film by sputtering under an atmosphere with a gas ratio of Ar gas : O2 gas that is 4:1; (S2000) Converting Cu2O into CuO through a thermal process
机译:用途:提供一种形成CuO薄膜的方法,一种制造氧化物薄膜晶体管的方法,由其制造的氧化物薄膜晶体管以及具有CuO薄膜的氧化物薄膜晶体管,以提高电场效应迁移率通过在低温下形成CuO薄膜来实现开/关比。组成:在氩气和氧气气氛下通过溅射形成Cu2O薄膜(S1000)。通过热处理将Cu 2 O薄膜变为CuO薄膜(S2000)。 Ar气与O 2气的比例为4∶1。热处理的加热温度为100至500摄氏度。热处理在空气气氛下进行。 [参考数字](AA)开始; (BB)结束; (S1000)在Ar气∶O 2气比为4∶1的气氛下,通过溅射形成Cu 2 O薄膜。 (S2000)通过热处理将Cu2O转化为CuO

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