Improvement of Interfacial Adhesion Strength of Flexible Substrates and Selective Growth Method of Aligned ZnO Nanopilar Arrays on Them

摘要

The invention interfacial bonding failure problem occurs because the lattice mismatch between the nanostructures formed on a flexible substrate and the by controlling the surface roughness of the flexible substrate by a plasma treatment in order to address a flexible substrate, a zinc oxide catalyst at a low temperature of less than 100 solution process on the flexible substrate using a technique of improving the interfacial bonding characteristics between ( a seed layer ) relates to a zinc oxide nano- pillar array (array) in a method of selectively growing aligned without . ;