首页> 外国专利> EXTREME ULTRAVIOLET RADIATION EXPOSURE MASK CAPABLE OF REDUCING REFLECTIVITY OF EUV LIGHT SOURCE AND EXPOSURE DEVICE INCLUDING THE SAME

EXTREME ULTRAVIOLET RADIATION EXPOSURE MASK CAPABLE OF REDUCING REFLECTIVITY OF EUV LIGHT SOURCE AND EXPOSURE DEVICE INCLUDING THE SAME

机译:能够降低EUV光源和包括其在内的曝光设备的反射率的极紫外辐射曝光框

摘要

PURPOSE: An extreme ultraviolet radiation exposure mask capable of reducing reflectivity of euv light source and exposure device including the same are provided to enhance yield of semiconductor devices.;CONSTITUTION: An extreme ultraviolet radiation exposure mask (200) comprises a substrate(100), a reflective layer(102) and absorber layers(104). The upper and lower parts of the substrate are bent. The reflective layer is included at the upper part of the substrate. The absorber layer is included at the upper part of the reflective layer. The substrate is bent based on the lower part, concave form or swollen form. The reflective layer includes lamination structure.;COPYRIGHT KIPO 2013
机译:目的:提供一种能够降低euv光源反射率的极紫外辐射曝光掩模和包括该极紫外辐射曝光掩模的曝光装置,以提高半导体器件的产量。;构成:一种极紫外辐射曝光掩模(200),包括基板(100),反射层(102)和吸收层(104)。基板的上部和下部弯曲。反射层被包括在基板的上部。吸收层包括在反射层的上部。基板基于下部弯曲,凹形或溶胀形。反射层包括层压结构。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130006748A

    专利类型

  • 公开/公告日2013-01-18

    原文格式PDF

  • 申请/专利权人 SK HYNIX INC.;

    申请/专利号KR20110046535

  • 发明设计人 MOON JAE IN;

    申请日2011-05-17

  • 分类号G03F1/22;G03F7/20;H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:50

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