THERMAL PROCESSING APPARATUS AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE CAPABLE OF IMPLEMENTING HIGH STABILITY AND PRECISION IN A PROCESS

摘要

PURPOSE: A thermal processing apparatus and a method for manufacturing a semiconductor device are provided to suppress a band effect of a thermal process and the discharge of heat in a substrate processing region by including a first heat blocking member and a second heat blocking member to face a heat insulation member.;CONSTITUTION: A manifold(44) supports a reaction tube(42). A heater(45) is installed around the reaction tube and heats the reaction tube and includes a temperature sensor(263) which senses the temperature of the heater. A circumference part(500) surrounds the side of the reaction tube. An exhaust device(301) forcedly exhaust a gap(506) between the circumference part and the reaction tube.;COPYRIGHT KIPO 2013