METHOD FOR MANUFACTURING A MULTILAYER PRINTED CIRCUIT BOARD CAPABLE OF REDUCING MANUFACTURING COSTS REQUIRED FOR DISPOSAL IN CASE OF A FAILURE IN AN INNER LAYER CIRCUIT PATTERN PORTION

摘要

PURPOSE: A method for manufacturing a multilayer printed circuit board is provided to improve workability and productivity and reduce manufacturing costs by performing post-processes such as formation of an outer layer circuit pattern portion while a plurality of PCB units having only good inner layer circuit pattern portions are arrayed on a working panel.;CONSTITUTION: A method of manufacturing a multilayer PCB comprises: preparing a working panel on which a plurality of PCB units having a plurality of inner layer circuit pattern portions are arrayed; removing a defective inner layer circuit pattern portion among the plurality of inner layer circuit pattern portions; providing a good inner layer circuit pattern portion in a portion of the working panel, from which the defective inner layer circuit pattern portion is removed; and forming an outer layer circuit pattern portion in the PCB unit.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Panel preparation step; (BB) Defective part removal step; (CC) Good part installation step; (DD) Outer layer forming step