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PROCESS CHAMBER LID DESIGN WITH BUILT-IN PLASMA SOURCE FOR SHORT LIFETIME SPECIES

机译:具有内置等离子体源的过程腔盖设计,可用于短寿命物种

摘要

The embodiment of the present invention generally closes the what apparatus and method for of what deposition materials, and especially Guan Yushe is with the vapor deposition chamber of the deposition materials during plasma enhanced processing procedure. In one embodiment, the chamber that one or more substrates are handled with what is provided. The chamber body includes: a chamber body defines a process volume; One substrate support, configuration is in the process volume and sets to support one or more substrates; One processing procedure cap assemblies configure above the substrate support, and wherein the processing procedure cap assemblies have a plasma-based cavity, which sets to generate a plasma-based and provide one or more free radical species to the process volume; One RF (radio frequency) power source couples gas distribution assembly; One plasma-based forms gas source, couples the processing procedure cap assemblies; And a reactant gas source, couple the processing procedure cap assemblies.
机译:本发明的实施例通常在等离子体增强处理过程期间用什么设备和方法关闭什么沉积材料,尤其是关羽社用沉积材料的气相沉积室关闭。在一个实施例中,提供一种处理一个或多个基板的腔室。腔室主体包括:腔室主体,其限定处理空间;以及一个基板支撑件的配置在处理体积中,并设置为支撑一个或多个基板。一种处理程序帽组件配置在衬底支撑件上方,并且其中处理程序帽组件具有基于等离子体的腔,其设置为生成基于等离子体的腔并向处理空间提供一种或多种自由基。一个RF(射频)电源耦合气体分配组件;一种基于等离子体的形式的气源,与处理程序帽组件耦合;和反应气体源,耦合处理程序帽组件。

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