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- PROCESS CHAMBER LID DESIGN WITH BUILT-IN PLASMA SOURCE FOR SHORT LIFETIME SPECIES

机译:-内置等离子体源的过程腔盖设计,可用于短寿命物种

摘要

the implementation of this example is to increase the material in good order on the device and method, and more specifically, the plasma - enhanced process, material to the kind of the card. in the coating chamber. it is one of the, or the additional board into the processing chamber in order to supply.chamber body, the processing volume of the chamber body, the process of volume in a layout or the additional support to the board. the board support body, the support body arranged on the board, the plasma to the ubc1cuc0dduc2dc then the process volume. one or the additional radical species in the area to provide the plasma cavity so that the assembly process.the gas distribution assembly for coupling the rf (radio frequency) power source, the process of the assembly and the coupling of the plasma of the gas source, and the process of the assembly and coupling of reaction gas source contains.
机译:此示例的实现是在设备和方法上以有序的方式增加材料,更具体地说,是通过等离子增强工艺将材料增加到卡片的种类。在涂层室中。它是向处理腔室中供应的另一种或另一种,以便提供腔室主体,腔室主体的处理体积,布局中的处理体积或对板的附加支撑。板支撑体,将支撑体布置在板上,等离子到 ubc1c uc0dd uc2dc然后处理量。在该区域中提供等离子体腔体的一种或另外的自由基物质,以便进行组装过程。用于耦合rf(射频)电源的气体分配组件,组装过程以及气体源的等离子体耦合,以及反应气体源的组装和耦合过程。

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