WAFER DRYING APPARATUS AND A WAFER DRYING METHOD USING THE SAME, CAPABLE OF REDUCING WATERMARK GENERATION

摘要

PURPOSE: A wafer drying apparatus and a wafer drying method using the same are provided to prevent leaning phenomenon of a micro pattern, by drying a wafer using a deionized CO2 water.;CONSTITUTION: A chamber includes a cleaning part and a drying part. An arrangement (108) is formed in the chamber. The arrangement settles a wafer. A deionized CO2 water supply nozzle part (110) supplies deionized CO2 water to the inside of the arrangement. An isopropyl alcohol (IPA) and N2 mixed gas supplying nozzle part (114) supplies IPA into the inside of the chamber.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Deionized CO2 water